CTS盡一切努力提供最優(yōu)質(zhì)的產(chǎn)品，以滿足眾多客戶的需求。雖然CTS供應(yīng)的產(chǎn)品看起來耐用，堅固和堅固，因為他們的剛性金屬，陶瓷或塑料包裝;內(nèi)部的組件可能對各種條件很敏感。因此，關(guān)于我們產(chǎn)品的處理和安裝，我們提出了以下建議。并非包羅萬象，但確實為更有效地處理石英晶體和石英晶體振蕩器提供了依據(jù)。

靜電放電(ESD)靈敏度

石英晶體(條形和圓形結(jié)構(gòu))本身通常對ESD不敏感。在操作過程中，應(yīng)采取適當?shù)念A(yù)防措施，避免靜電產(chǎn)生，以免損壞其他電路。

石英振蕩器是ESD敏感的。這些部件應(yīng)使用所有適用的防靜電處理預(yù)防措施進行處理，即靜電防護工作站。CTS振蕩器產(chǎn)品包裝在適當?shù)?/span>ESD包裝中，以保護它們。

機械沖擊

晶體所遭受的機械沖擊會降低其電氣參數(shù)，損壞環(huán)氧樹脂安裝結(jié)構(gòu)或永久破壞晶體晶片本身。從桌面輕輕落下就能產(chǎn)生高達幾千g的沖擊。在適當?shù)那闆r下，我們盡一切努力使我們的產(chǎn)品對機械沖擊的敏感性降到最低。設(shè)備不應(yīng)掉落在堅硬的表面上，如地板和桌面。最終用戶應(yīng)考慮實施規(guī)則和培訓，使產(chǎn)品下降超過8英寸被認為是損壞的嫌疑，并保留處理。一般來說，CTS晶振建議處理掉的產(chǎn)品。

生產(chǎn)過程

在將振蕩器插入印刷電路板時，應(yīng)特別注意引腳的方向。如果安裝不正確，可能會對本機造成電氣損壞。

拾取和放置設(shè)備，測試夾具和其他工藝工具會對晶體和振蕩器產(chǎn)品施加可能導致?lián)p壞的機械應(yīng)力。適當?shù)脑O(shè)備設(shè)置和過程監(jiān)控是必要的，以盡量減少可能影響長期可靠性的過程的影響。

產(chǎn)品移除

當晶體和振蕩器從應(yīng)用板上取下時，會發(fā)生機械損傷

使用適當?shù)娜ズ冈O(shè)備和技術(shù)。金屬密封包裝利用玻璃到金屬密封周圍的引腳是脆弱的。施加過多的熱量和力量會使玻璃破裂，危及長期使用

可靠性和潛在的災(zāi)難性故障。當加熱不均勻或在移除過程中使用過大的力時，陶瓷表面安裝包容易開裂。

Every effort is made by CTS to supply the highest quality products that are able to satisfy a multitude of applications. All though the products that CTS supplies appear durable, strong and sturdy because of their rigid metal, ceramic or plastic package; the components inside may be sensitive to a variety of conditions. As a result,we have developed the following suggestions regarding the handling and installation of our products. This list is not all-inclusive, but does provide a basis for more effective handling of quartz crystal and crystal oscillator products.進口晶振

Electrostatic Discharge (ESD) Sensitivity

Quartz crystals (strip and round configurations) by themselves are typically not sensitive to ESD. Proper  precautions should betaken to avoid ESD during handling due to the potential damage to other circuitry.

Quartz oscillators are ESD sensitive. These components should be handled using all applicable ESD handling precautions, i.e. static safeguarded workstations. CTS oscillator products are packaged in appropriate ESD packaging for their protection.

Mechanical Shock

The amount of mechanical shock that a crystal is exposed to can degrade its electrical parameters, damage the epoxy mount structure or permanently destroy the crystal wafer itself. A short drop from a tabletop can result in shock levels as high as several thousand g’s. Every effort is made to minimize the susceptibility of our products to mechanical shock where appropriate. Units should not be dropped onto hard surfaces such as floors and

tabletops. End users should consider implementing rules and training such that product dropped more than eight inches be considered suspect for damage and held for disposition. Generally, we recommend disposal of dropped product.

Manufacturing Process

Care should betaken when inserting an oscillator into a printed circuit board by paying close attention to the pin orientation. Electrical damage can occur to the unit if it is installed incorrectly.

Pick and place equipment, test fixtures and other process tooling can place mechanical stresses on crystal and  oscillator product that may cause damage. Proper equipment set-up and in-process monitoring is necessary to minimize the effects of process that may affect long-term reliability.

Product Removal

Mechanical damage can occur when crystals and oscillators are being removed from application boards without

using proper de-soldering equipment and techniques. Metal hermetic packages utilize glass to metal seals around the pins that are fragile. Applying excessive heat and force will fracture the glass, jeopardizing the long-term

reliability and potentially cause a catastrophic failure. Ceramic surface mount packages are susceptible to cracking when uneven heating or excessive force is used during removal.